2017 EVG 510 Wafer Bonder System

2017 EVG 510 Wafer Bonder System

Contact us for price

Description

Wafer size      3” but can go to 6in 


Plasma Primer – NO


Process ? Fusion of 3/5 materials. It can do Silicon fusion.


Last process was March-2025 and the operation was fine.


Missing part/malfunction – None that we know about.


O/S – Windows 7 Service Pack 1


S/W – 2.7.4.20.

Specifications

ManufacturerEVG
Model510 Wafer Bonder System
Year2017
ConditionUsed
Stock NumberGOD23082023720223515