2017 EVG 510 Wafer Bonder System

Wafer size      3” but can go to 6in 

Plasma Primer – NO

Process ? Fusion of 3/5 materials. It can do Silicon fusion.

Last process was March-2025 and the operation was fine.

Missing part/malfunction – None that we know about.

O/S – Windows 7 Service Pack 1

S/W – 2.7.4.20.