2017 EVG 510 Wafer Bonder System

2017 EVG 510 Wafer Bonder System
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Description
Wafer size 3” but can go to 6in
Plasma Primer – NO
Process ? Fusion of 3/5 materials. It can do Silicon fusion.
Last process was March-2025 and the operation was fine.
Missing part/malfunction – None that we know about.
O/S – Windows 7 Service Pack 1
S/W – 2.7.4.20.
Specifications
Manufacturer | EVG |
Model | 510 Wafer Bonder System |
Year | 2017 |
Condition | Used |
Stock Number | GOD23082023720223515 |